Abstract : This study investigates the effect of various diode laser wavelengths (450, 810, and 980 nm) on the ease and safety of orthodontic bracket removal, particularly focusing on the required force for debonding anxd the intrapulpal temperature change during laser application. A total of 72 noncarious premolars with bonded brackets were utilized. These were divided into four groups (18 specimens each): Group 0 (G0), debonding without laser; Group 1 (G1), using an 810 nm diode laser; Group 2 (G2), using a 980 nm laser; and Group 3 (G3), employing a 450 nm laser. A power setting of 3 W was applied for 5 seconds in a circular motion around the brackets. The study measured the shear bond strength (SBS) necessary for debonding and the intrapulpal temperature increase during irradiation, using statistical analysis with a significance threshold of p ≤ 0.05. The SBS in G0 was significantly higher than in the laser-treated groups (G1, G2, G3; p < 0.05). Among the laser groups, G3 showed significantly lower SBS compared to G1 and G2 (p < 0.05), while no notable difference was found between G1 and G2 (p = 0.084). Regarding intrapulpal temperature, G3 recorded a significantly lower increase than the other groups (p < 0.05), with no significant difference observed between G1 and G2 (p = 0.5735). The application of diode lasers, particularly the 450 nm wavelength, was correlated with reduced SBS and minimal intrapulpal temperature elevation, suggesting a potentially safer and more efficient method for orthodontic bracket removal.